1. TFC-HF-108(SAC) series syringe solder paste is lead-free and environmentally friendly composed of special helper and spherical helper powder with low oxidation degree. It adopts high-performance thixotropic agent, has superior solubility and sustainability, and is suitable for mounting fine-pitch devices (QFP, etc.).
2. syringe solder paste characteristics
(1) This product is a washout type with very little residue after returning, which can meet the test performance of ICT probe.
(2) continuous printing, the viscosity change is small, can obtain a very stable effect.
(3) It has excellent weldability and can show proper wettability in different welding parts.
(4) It can be applied to the return furnace with nitrogen under general atmosphere.
(5) At very high peak temperatures, good weldability can also be obtained.
(6) After returning, the solder balls are very few, the solder joints have good luster and excellent electrical conductivity.
(7) Helper carrier has no pungent odor and volatilizes slowly. It can be applied for a long time without affecting the tin effect of solder paste.
(8) excellent film removal, needle point coating operation and point coating is not easy to collapse, can reduce the occurrence of short circuit.
(9) long time point syringe coating is not easy to plug the needle.
3. characteristic composition and others
TFC-HF-108(SAC series) various characteristics of lead-free solder paste, such as table -1 and table -2:

Table -1

Table -2

Quality assurance period: The quality assurance period is 120 days after manufacture, but it must be sealed and stored at 5-10 ℃ and below 75% RH.

use should pay attention to matters: solder paste from the refrigerator to take out the solder paste must first make it back to room temperature (at 25 DEG C for at least 4 hours), if not back to room temperature before opening, solder paste will inevitably absorb moisture, resulting in the occurrence of adverse phenomena.
Sticky assembly time of components: Sticky assembly of components shall be carried out within 2 hours after solder paste printing/spot coating. If it is left for too long after printing, the surface of the solder paste will be dry and cause the components to stick unsmoothly.

safety and health should pay attention to matters.

(1) This product does not contain specific controlled chemical substances.
(2) It also does not contain organic solvents regulated in the rules for the prevention of organic solvent poisoning, but care should still be taken to avoid inhalation of gases emitted by molten solder paste and contamination of the skin with solder paste. If there is solder paste contamination of the skin, should be immediately wiped with ethanol-containing cotton flowers, and then washed with soap and water.