TAIYOTY-A1Xalloy system design ideas
low thermal expansion coefficient and good mechanical propertiesmaterialhas been widely used in low-temperature packaging of electronic packaging, which can effectively reduce the thermal stress of welded joints in the process of multiple reflow soldering. Moreover, after high-temperature aging, the microstructure and intermetallic compounds of the alloy are extremely serious, which makes the alloy brittle failure due to the reduction of plasticity, resulting in the reduction of the reliability of welded joints, the microstructure of the alloy and the coarsening of intermetallic compounds are extremely serious, which makes the alloy brittle failure due to the decrease of plasticity, which leads to the decrease of the reliability of the welded joint.TAIYOlead-free tin wireTY-A1XAlloy,Adopts New Alloy Design Concept,developedSnAgCuXmulti-eutectic alloy.alloy melting point195°C,good wettability, to ensure that the low temperature welding process requirements at the same time, fundamentally solve the current commonly used.lowthe problem of poor reliability of warm materials.
alloys
(tensile rate:2mm/min)
tensile strength/Mpayield strength/Mpaelongation%
SAC305 46.5 41.5 43.5
TY-A1X474541
Wetting parameter performance
Alloy CompositionMaximum wetting force(MN)
TY-A1X0.63
alloy balance wetting force,TY-A1Xalloy has a large balanced wetting force, showing its excellent alloy wetting properties.
Alloys
impact fatigue fracture cycle/times
Alloy Compositionalloy
SAC305 6434
TY-A1X6233
low temperature tin wire improvementPP,PVChigh-speed core wire insulation is poor.: Hipot SI
material
Solder joint tension
Fatigue performance Cold and hot shock test
solder joint analysis
